In the new production unit, both flat and linear electronic assemblies are laminated with several polymer materials. Depending on the intended use, the material composition can be adapted. In the lamination process, several layers of plastic are applied to the front and back of the flexible PCB material using heat and pressure.
During this process, the components assembled on the flexible PCB are encapsulated, excluding any air residues in the material composite. Since only very thin layers are used, the flexibility of the module is still maintained and at the same time the mechanical resistance increases significantly. The high transparency of the materials used makes the innovative technology a perfect complement for modules with LEDs or optical sensors.